Zierick Manufacturing Corporation introduces a new surface mount pin header. The header assembly consists of square posts press-fit into round plated through holes on a "header printed circuit board." A circular solder pad on top of the board and a square solder pad on the bottom are connected to the conductive plate of the through hole. The size of the hole is such that it holds the square pin in place, yet leaves four cavities defined by the flat side of the pin and the curved wall of the hole. The cavities promote capillary action by drawing up most of the melted solder through the cavities where it forms a ring at the top. This action pulls the header board assembly into proper position, even if it is placed off center on the PCB. Co-planarity problems are eliminated, and a much stronger solder joint produces 50% higher retention force than J-Lead headers. The solder ring formed at the top side of the header assembly board is a visual indication that the reflow process is complete.
To learn more, please use our email form, call us at 800-882-8020 (in New York, 914-666-2911) or write Zierick Manufacturing Corporation, Radio Circle, Mt. Kisco, New York 10549, fax 914-666-0216.
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