Features and Benefits |
- Designed for demanding applications with shock, vibration, and elevated temperatures
- Capillary Action is utilized to improve solder joint strength and pin retention force - 50% higher than J-lead headers
- High resistance to thermal shock and thermal cycling due to material selection
- Co-planarity problems eliminated
- Very forgiving board placement tolerances
- Minimal real estate required on board
- Zierick’s Horizontal Header is easily customized for a combination of different pin lengths and missing pins for proper mating connector orientation
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Resources | Drawings | 2D drawing (online view) | Additional Resources | Printer Friendly Version | Technology Overview | | Disclaimer | Product specifications listed on the website, catalog, or any documents that may fall under the category of promotional literature are subject to change without notice without creating liability to Zierick Manufacturing Corporation. Please contact us for the most current prints and dimensions. | |
Loose |
Number of Rows |
Pins per Row |
Pin Length Dimensions |
Finish Specification |
Current Rating |
H1-1-500-T |
1 |
1 |
0.500" (12.70mm) |
Tin Plated |
8/Pin |
U.S. Patent Nos. 6,402,531 B1 and 5,816,668 |
Zierick recommends .006" (0.15mm) stencil thickness for most applications. For other stencil thicknesses, call Zierick's product development department. |
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