Home
about usnewsresourcespart findermating partsloginfaq


categorySurface Mount
categoryTechnology Overview
categoryApplication Design Concepts
categoryPins and Posts
category Technology Overview
category 0.025" Posts
category Z-Axis Compliant Pin
category Technology Overview
categoryPart Numbers 1264 / 6264
category Solid Pins
categoryTabs / Quick Disconnect Terminals
categoryHeaders
categoryBoard Stacking Connectors
categoryWire Connectors
categoryJumpers
categoryReceptacles
categoryEdge
categoryCoaxial Connectors
categoryPlating Specifications

Technology Overview

   SMT Z-Axis Complaint Pin
Degree of physical change to pin has been enhanced and exaggerated for demonstration purposes.
 
A primary benefit of the SMT Z-Axis Compliant Pin is its ability to hold a strong, accurate connection under extreme temperature changes. Its Z-Axis (axial) compliancy is designed to compensate for thermal expansion and contraction.

As temperatures cause boards to shift, the pin compensates for separation, and holds a stronger, more dependable connection. The pin's unique, flexible center-frame design actually expands or contracts in response to changes in board orientation.

Uniquely designed for production in a continuous reel format, the SMT Z-Axis Compliant Pin optimizes automation, and allows precision placement while using existing pick and place equipment. Z-Axis Compliant Pins can be placed on 0.100" x 0.120" on-center applications, making them ideal for parallel stacking applications.

Zierick designed the Z-Axis Pin to take advantage of capillary action, a process in which a more complete, more stable solder connection is established, providing superior joint strength and more reliably perpendicular pins. The Z-Axis Pins are manufactured using 0.012" (0.30mm) thick Copper, and feature a 100% Matte Tin over Copper finish.

Benefits
Zierick’s SMT Z-Axis Compliant Pin:

Increases PCB design flexibility.
  • Compensates for thermal expansion and contraction through axial compliancy
  • Consumes minimal real estate
Optimizes automation.
  • Enables the random placement of individual pins
  • Allows for pin placement on 0.100" x 0.120" on-center applications
Allows for a better connection.
  • Maximizes solder joint strength through utilization of capillary action
  • Ensures that pins are reliably perpendicular
  • Enhances geographical stability with high locational tolerances
 
See What We Have to Offer
Learn More about Zierick
Get Help When You Need It
previous next ZMC ISO 9001 Certification Council of Industry of Southeastern New York Precision Metalforming Association Zierick on YouTube Zierick on Facebook Zierick on Blogger Zierick on LinkedIn