Part Numbers H1-2-150-467-T, H1-2-295-500-T

Features and Benefits
  • Designed for demanding applications with shock, vibration, and elevated temperatures
  • Capillary Action is utilized to improve solder joint strength and pin retention force - 50% higher than J-lead headers
  • High resistance to thermal shock and thermal cycling due to material selection
  • Co-planarity problems eliminated
  • Very forgiving board placement tolerances
  • Minimal real estate required on board
  • Zierick’s Horizontal Header is easily customized for a combination of different pin lengths and missing pins for proper mating connector orientation
Loose Number of Rows Pins per Row Pin Length Dimensions Finish Specification Current Rating
H1-2-150-467-T 1 2 0.150" (3.81mm) and 0.467" (mm) Tin Plated 8/Pin
H1-2-295-500-T 1 2 0.295" (7.49mm) and 0.500" (mm) Tin Plated 8/Pin
U.S. Patent Nos. 6,402,531 B1 and 5,816,668
Zierick recommends .006" (0.15mm) stencil thickness for most applications. For other stencil thicknesses, call Zierick's product development department.