Part Numbers H1-x-xxx, H2-x-xxx

Features and Benefits
  • Designed for demanding applications with shock, vibration, and elevated temperatures
  • Capillary Action is utilized to improve solder joint strength and pin retention force - 50% higher than J-lead headers
  • High resistance to thermal shock and thermal cycling due to material selection
  • Co-planarity problems eliminated
  • Very forgiving board placement tolerances
  • Minimal real estate required on board
  • Zierick’s Horizontal Header is easily customized for a combination of different pin lengths and missing pins for proper mating connector orientation
Loose Number of Rows Pins per Row Pin Length Dimensions Finish Specification
H1-2-375-G 1 2 0.375" (9.53mm) Gold Plated
H1-2-375-T 1 2 0.375" (9.53mm) Tin Plated
H1-2-500-G 1 2 0.500" (12.70mm) Gold Plated
H1-2-750-T 1 2 0.750" (19.05mm) Tin Plated
H1-3-250-T 1 3 0.250" (6.35mm) Tin Plated
H1-3-375-T 1 3 0.375" (9.53mm) Tin Plated
H1-3-625-T 1 3 0.625" (15.88mm) Tin Plated
H1-3-750-T 1 3 0.750" (15.88mm) Tin Plated
H1-4-375-T 1 4 0.375" (9.53mm) Tin Plated
H1-4-500-14 1 4 0.500" (12.70mm) Gold Plated
H1-4-500-T 1 4 0.500" (12.70mm) Tin Plated
H1-5-250-T 1 5 0.250" (6.35mm) Tin Plated
H1-5-500-14 1 5 0.500" (12.70mm) Gold Plated
H1-5-500-T 1 5 0.500" (12.70mm) Tin Plated
H1-6-375-T 1 6 0.375" (9.53mm) Tin Plated
H1-6-500-T 1 6 0.500" (12.70mm) Tin Plated
H1-6-625-G 1 6 0.625" (15.88mm) Gold Plated
H1-6-750-T 1 6 0.750" (19.05mm) Tin Plated
H1-9-500-T 1 9 0.500" (12.70mm) Tin Plated
H2-3-750-T 2 3 0.750" (19.05mm) Tin Plated
H2-5-375-T 2 5 0.375" (9.53mm) Tin Plated
Pins are 0.025" (0.64mm) Square
Current Rating: 8/Pin
U.S. Patent Nos. 6,402,531 B1 and 5,816,668
Zierick recommends .006" (0.15mm) stencil thickness for most applications. For other stencil thicknesses, call Zierick's product development department.