Part Numbers H1-10-750-T-SP, H1-9-500-T-SP

Features and Benefits
  • Designed for demanding applications with shock, vibration, and elevated temperatures
  • Capillary Action is utilized to improve solder joint strength and pin retention force - 50% higher than J-lead headers
  • High resistance to thermal shock and thermal cycling due to material selection
  • Co-planarity problems eliminated
  • Very forgiving board placement tolerances
  • Minimal real estate required on board
  • Zierick’s Horizontal Header is easily customized for a combination of different pin lengths and missing pins for proper mating connector orientation
Loose Number of Rows Pins per Row Pin Length Dimensions Number of Missing Pins Finish Specification Current Rating
H1-10-750-T-SP 1 10 0.750" (19.05mm) 2 Tin Plated 8/Pin
H1-9-500-T-SP 1 9 0.500" (12.70mm) 2 (#2 and #7) Tin Plated 8/Pin
U.S. Patent Nos. 6,402,531 B1 and 5,816,668
Zierick recommends .006" (0.15mm) stencil thickness for most applications. For other stencil thicknesses, call Zierick's product development department.