Zierick Manufacturing: Engineered Interconnection Solutions
home home surface mount connectors through hole connectors hardware equipment custom solutions home
About Us
History
Capabilities
Terminal-to-PCB Retention
Harsh Environment IDC
Mechanical Hold-Down
Surface Mount Odd-Form Terminals
Solder-Wicking
Parallel Stacking System
Receptacles
Board Stuffing Service
Custom Solutions
Upcoming Zierick Trade Shows
Parallel Stacking System
  
The uniquely shaped Pro-Wave socket fulfills parallel PCB stacking needs in a high-speed matched impedance environment.
Zierick's Pro-Wave interconnection system enables customers to parallel stack several dozen multi-layer circuit boards in a high-speed matched impedance environment, creating a three-dimensional circuit. This solderless interconnection system utilizes pins and internal sockets. The Pro-Wave system allows a staggered row grid density of 0.050" and a minimum PCB-to-PCB interface of 0.062". It accommodates boards with through-holes varying from 0.020" to 0.025" in diameter.

Continuous format Pro-Wave sockets permit placement by automatic equipment in any number of pin counts on both standard and special grid spacings.



Need more information about this Zierick technology?


©2011 Zierick Manufacturing Corporation • 131 Radio Circle, Mt. Kisco, NY 10549 USA • 800-882-8020 • contactus@zierick.com